IEEE - Institute of Electrical and Electronics Engineers, Inc. - 5C-2 Non-Invasive Ultrasound Elastic Modulus Estimates on Tissue Scaffold Mechanical Property Change

2007 IEEE Ultrasonics Symposium

Author(s): K. Kim ; M.S. Richards ; C.G. Jeong ; S.J. Hollister
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2007
Conference Location: New York, NY, USA
Conference Date: 28 October 2007
Page(s): 347 - 350
ISBN (CD): 978-1-4244-1384-3
ISBN (Paper): 978-1-4244-1383-6
ISSN (Paper): 1051-0117
DOI: 10.1109/ULTSYM.2007.97
Regular:

Tissue engineers are greatly interested in non- invasively evaluating the extent of cell growth, scaffold degradation, and tissue development both in vitro and in vivo as a function of time.... View More

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