IEEE - Institute of Electrical and Electronics Engineers, Inc. - Development and Characterization of Silicon via Tapering Process for 3D System in Packaging Application
14th International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA 2007
Author(s): | N. Ranganathan ; Liao Ebin ; N. Balasubramanian ; K. Prasad ; K.L. Pey |
Publisher: | IEEE - Institute of Electrical and Electronics Engineers, Inc. |
Publication Date: | 1 July 2007 |
Conference Location: | Bangalore, India |
Conference Date: | 11 July 2007 |
ISBN (CD): | 978-1-4244-1015-6 |
ISBN (Paper): | 978-1-4244-1014-9 |
DOI: | 10.1109/IPFA.2007.4378105 |
Regular:
Through-silicon interconnection technology is considered to be a critical and enabling technology for 3-D stacking of electronic and electro-mechanical systems, which is believed to be a solution... View More