IEEE - Institute of Electrical and Electronics Engineers, Inc. - Development and Characterization of Silicon via Tapering Process for 3D System in Packaging Application

14th International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA 2007

Author(s): N. Ranganathan ; Liao Ebin ; N. Balasubramanian ; K. Prasad ; K.L. Pey
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 July 2007
Conference Location: Bangalore, India
Conference Date: 11 July 2007
ISBN (CD): 978-1-4244-1015-6
ISBN (Paper): 978-1-4244-1014-9
DOI: 10.1109/IPFA.2007.4378105
Regular:

Through-silicon interconnection technology is considered to be a critical and enabling technology for 3-D stacking of electronic and electro-mechanical systems, which is believed to be a solution... View More

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