IEEE - Institute of Electrical and Electronics Engineers, Inc. - Ultrasonic stimulus and response tests leveraging modular instrumentation

IEEE Autotestcon 2007. Systems Readiness Technology Conference

Author(s): C.D. Kuenzi ; S.A. Knapp-Kleinsorge
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2007
Conference Location: Baltimore, MD, USA
Conference Date: 17 September 2007
Page(s): 589 - 597
ISBN (CD): 978-1-4244-1239-6
ISBN (Paper): 978-1-4244-1238-9
ISSN (Paper): 1088-7725
DOI: 10.1109/AUTEST.2007.4374272
Regular:

Ultrasonic testing is being used increasingly across many industries and engineers are turning to modular instrumentation as a solution for these complex and dynamic challenges. The most common... View More

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