IEEE - Institute of Electrical and Electronics Engineers, Inc. - Deep-Trench Process Technology for Three-Dimensionally Integrated SOI-Based Image Sensors

2007 IEEE International SOI Conference

Author(s): D.J. Young ; J.M. Knecht ; D.D. Rathman ; K. Warner ; D.-R. Yost ; K. Newcomb ; V. Suntharalingam
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2007
Conference Location: Indian Wells, CA, USA
Conference Date: 1 October 2007
Page(s): 97 - 98
ISBN (CD): 978-1-4244-0880-1
ISBN (Paper): 978-1-4244-0879-5
ISSN (Paper): 1078-621X
DOI: 10.1109/SOI.2007.4357870
Regular:

Large arrays of scientific imaging devices are in demand for wide-field-of-view imaging systems. We present a deep-trench process technology that enables the fabrication of SOI-based,... View More

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