IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal Modeling and Device Noise Properties of 3D-SOI Technology

2007 IEEE International SOI Conference

Author(s): Tze Wee Chen ; Jung Hoon Chun ; Yi-chang Lu ; R. Navid ; Wei Wang ; R.W. Dutton
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2007
Conference Location: Indian Wells, CA, USA
Conference Date: 1 October 2007
Page(s): 89 - 90
ISBN (CD): 978-1-4244-0880-1
ISBN (Paper): 978-1-4244-0879-5
ISSN (Paper): 1078-621X
DOI: 10.1109/SOI.2007.4357866
Regular:

This article deals with performance of 3D-IC which is influenced by thermal effects as well as 3D packaging and parasitic effects. Actual circuit performance is difficult to predict as thermal and... View More

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