IEEE - Institute of Electrical and Electronics Engineers, Inc. - DBC Technology for Extremely Thin Flat Heat Pipes

2007 IEEE Industry Applications Conference - Forty-Second IAS Annual Meeting

Author(s): L. Kamenova ; Y. Avenas ; C. Schaeffer ; G. Kapelski ; S. Tzanova ; J. Schulz-Harder
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2007
Conference Location: New Orleans, LA, USA
Conference Date: 23 September 2007
Page(s): 1,412 - 1,418
ISBN (CD): 978-1-4244-1260-0
ISBN (Paper): 978-1-4244-1259-4
ISSN (Paper): 0197-2618
DOI: 10.1109/07IAS.2007.218
Regular:

This paper presents the conception and the experimental procedures of flat copper heat pipe embedded in extremely thin 3D packaging substrates. Since conventional machining for this application is... View More

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