IEEE - Institute of Electrical and Electronics Engineers, Inc. - Study on the Board-level SMT Assembly and Solder Joint Reliability of Different QFN Packages

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007

Author(s): Wei Sun ; W.H. Zhu ; R. Danny ; F.X. Che ; C.K. Wang ; A.Y.S. Sun ; H.B. Tan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2007
Conference Location: London, UK
Conference Date: 16 April 2007
Page(s): 1 - 6
ISBN (CD): 1-4244-1106-8
ISBN (Paper): 1-4244-1105-X
DOI: 10.1109/ESIME.2007.360010
Regular:

The current paper deals with firstly the optimized SMT to assemble various types of QFN (Quad Flat Non- leaded) packages. The important SMT factors such as solder pad and stencil designs will be... View More

Advertisement