IEEE - Institute of Electrical and Electronics Engineers, Inc. - A Study on Inter-Metallic Compound Formation and Structure of Lead Free SnAgCu Solder System

2006 IEEE International Conference on Semiconductor Electronics

Author(s): I. Ahmad ; Hoh Huey Jiun ; Eu Poh Leng ; B.Y. Majlis ; A. Mar ; R. Wagiran
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2006
Conference Location: Kuala Lumpur, Malaysia
Conference Date: 29 October 2006
Page(s): 545 - 548
ISBN (CD): 0-7803-9731-2
ISBN (Paper): 0-7803-9730-4
DOI: 10.1109/SMELEC.2006.380690
Regular:

This paper characterizes the effect of various Sn-Ag-Cu solder compositions towards shear strength and melting behavior. Shear strength is measured by Dage which is representative of the... View More

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