IEEE - Institute of Electrical and Electronics Engineers, Inc. - Simulating Analysis of Dynamic Responses for CSP under Board Level Drop Test

2006 7th International Conference on Electronic Packaging Technology

Author(s): Kailin Pan ; Bin Zhou ; Yilin Yan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2006
Conference Location: Shanghai, China
Conference Date: 26 August 2006
Page(s): 1 - 5
ISBN (CD): 1-4244-0620-X
ISBN (Paper): 1-4244-0619-6
DOI: 10.1109/ICEPT.2006.359786
Regular:

Along with the more and more use of portable electronic products, such as mobile phones and PDA, the drop impact performance of solder joints for CSP is a critical concern to semiconductor and... View More

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