IEEE - Institute of Electrical and Electronics Engineers, Inc. - Application of EDS Technique for OSP Film Thickness Measurement

Proceedings of the 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Author(s): K. Prong ; K. Sirarat
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 July 2006
Conference Location: Singapore, Singapore
Conference Date: 3 July 2006
Page(s): 200 - 204
ISBN (CD): 1-4244-0206-9
ISBN (Paper): 1-4244-0205-0
DOI: 10.1109/IPFA.2006.251030
Regular:

Nowadays, there are numbers of pad finishing types in market for ball grid array package (BGA). OSP (organic solderability preservatives) pad finishing technology is one of the most widely used... View More

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