IEEE - Institute of Electrical and Electronics Engineers, Inc. - Novel nanotechnology for environmentally friendly interconnect materials in microelectronic packaging applications

Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment

Author(s): Yi Li ; Kyoung-sik Moon ; C.P. Wong
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2006
Conference Location: Scottsdale, AZ, USA
Conference Date: 8 May 2006
Page Count: 6
Page(s): 32 - 37
ISBN (Paper): 1-4244-0351-0
ISSN (Paper): 1095-2020
DOI: 10.1109/ISEE.2006.1650027
Regular:

Recently, anisotropic conductive adhesives (ACAs) have attracted increasing interests as environmentally friendly materials in electronic packaging industry because they are lead-free, require... View More

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