IEEE - Institute of Electrical and Electronics Engineers, Inc. - Water and Copper Contamination in SiOC:H Damascene: Novel Characterization Methodology based on Triangular Voltage Sweep Measurements

Proceedings of the IEEE 2006 International Interconnect Technology Conference

Author(s): I. Ciofi ; Z. Tokei ; D. Visalli ; M. Van Hove
Sponsor(s): IEEE Electron Devices Soc
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2006
Conference Location: Burlingame, CA, USA
Conference Date: 5 June 2006
Page Count: 3
Page(s): 181 - 183
ISBN (Paper): 1-4244-0104-6
DOI: 10.1109/IITC.2006.1648682
Regular:

We evaluated the triangular voltage sweep (TVS) method as a new technique to address the degradation mechanisms that occur in Cu/low-k interconnects. TVS measurements were performed on dedicated... View More

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