IEEE - Institute of Electrical and Electronics Engineers, Inc. - A 3-D Microfluidic/Electronic Scaffold for Increased Viability and Analysis of Thick in Vitro Brain Slices

19th IEEE International Conference on Micro Electro Mechanical Systems

Author(s): L. Rowe ; M.A. McClain ; M. Almasri ; K. Lee ; A.B. Frazier
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2006
Conference Location: Istanbul, Turkey, Turkey
Conference Date: 22 January 2006
Page(s): 446 - 449
ISBN (Paper): 0-7803-9475-5
ISSN (Paper): 1084-6999
DOI: 10.1109/MEMSYS.2006.1627832
Regular:

This paper presents a novel 3-D scaffold for culturing thick in vitro brain slices. The microscaffold consists of a 12x12 array of spiked SU-8 microtowers with integrated fluidic properties for... View More

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