IEEE - Institute of Electrical and Electronics Engineers, Inc. - Failure analysis of lead-free Sn-Ag-Cu solder joints for 316 I/O PBGA package

Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Author(s): Luhua Xu ; J.H.L. Pang ; Che Faxing
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Singapore, Singapore
Conference Date: 27 June 2005
Page Count: 5
Page(s): 323 - 327
ISBN (Paper): 0-7803-9301-5
DOI: 10.1109/IPFA.2005.1469188
Regular:

Failure analysis of lead-free solder joints for PBGA assemblies subjected to thermal cycling aging is reported. Experimental strain analysis using the digital image speckle analysis (DISA) method... View More

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