IEEE - Institute of Electrical and Electronics Engineers, Inc. - Micro-impact test on lead-free BGA balls on Au/electrolytic Ni/Cu bond pad

2005 Proceedings. 55th Electronic Components and Technology Conference

Author(s): Shengquan Ou ; Yuhuan Xu ; K.N. Tu ; M.O. Alam ; Y.C. Chan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Lake Buena Vista, FL, USA
Conference Date: 31 May 2005
Page Count: 5
ISBN (Paper): 0-7803-8907-7
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2005.1441307
Regular:

The most frequent failure of wireless, handheld, and movable consumer electronic products is an accidental drop to the ground. The impact may cause interfacial fracture of wire-bonds or solder... View More

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