IEEE - Institute of Electrical and Electronics Engineers, Inc. - Finite element analysis of lead-free drop test boards

2005 Proceedings. 55th Electronic Components and Technology Conference

Author(s): P. Marjamaki ; T. Mattila ; J. Kivilahti
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Lake Buena Vista, FL, USA
Conference Date: 31 May 2005
Page Count: 5
ISBN (Paper): 0-7803-8907-7
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2005.1441306
Regular:

Lead-free CSP assemblies were drop tested according to the JEDEC standard (JESD-B111) and the finite element analysis of the test assembly was carried out to simulate the strain and stress... View More

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