IEEE - Institute of Electrical and Electronics Engineers, Inc. - Alternative double pass dicing method for thin wafer laminated with die attach film

2004 IEEE International Conference on Semiconductor Electronics

Author(s): Hoh Huey Jiun ; I. Ahmad ; A. Jalar ; G. Omar
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2004
Conference Location: Kuala Lumpur, Malaysia
Conference Date: 7 December 2004
ISBN (Paper): 0-7803-8658-2
DOI: 10.1109/SMELEC.2004.1620967
Regular:

This paper introduces an alternative dicing method to reduce lateral crack and chipping problem in dicing 100 /spl mu/m thickness wafer laminated with die attach film (DAF). Conventional single... View More

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