IEEE - Institute of Electrical and Electronics Engineers, Inc. - Application of Auger electron spectroscopy (AES), TEM electron energy loss spectrum (EELS) in failure analysis on poly grooves issue in wafer fabrication

2004 IEEE International Conference on Semiconductor Electronics

Author(s): Phong Ooi Lin ; Ang Ghim Boon ; Chua Kok Keng ; Oh Chong Khiam ; Lo Keng Foo
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2004
Conference Location: Kuala Lumpur, Malaysia
Conference Date: 7 December 2004
ISBN (Paper): 0-7803-8658-2
DOI: 10.1109/SMELEC.2004.1620894
Regular:

In this paper, a case study on the failure analysis and yield enhancement on poly grooves/divots in wafer fabrication was investigated and studied. Several failure analysis techniques and tools... View More

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