IEEE - Institute of Electrical and Electronics Engineers, Inc. - The surface site dehydration mechanism for Si/sub 3/N/sub 4/ sensing membrane by post-baking treatment

2004 IEEE International Conference on Semiconductor Electronics

Author(s): Chao-Sung Lai ; Chia-Ming Yang ; Chih-Yao Wang ; Cheng-En Lue ; T.F. Lue ; Hung-Pin Ko ; T.M. Wang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2004
Conference Location: Kuala Lumpur, Malaysia
Conference Date: 7 December 2004
ISBN (Paper): 0-7803-8658-2
DOI: 10.1109/SMELEC.2004.1620892
Regular:

This work presented a post-baking treatment effect on Si/sub 3/N/sub 4/ sensing membrane for the pH response. Special measurement sequences were proposed to verify the surface site activation and... View More

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