IEEE - Institute of Electrical and Electronics Engineers, Inc. - The impact of moisture in mold compound preforms on the warpage of PBGA packages

28th International Electronics Manufacturing Technology Symposium

Author(s): T.Y. Lin ; B. Njoman ; D. Crouthamel ; K.H. Chua ; S.Y. Teo
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2003
Conference Location: San Jose, CA, USA, USA
Conference Date: 16 July 2003
Page Count: 6
Page(s): 273 - 278
ISBN (Paper): 0-7803-7933-0
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.2003.1225913
Regular:

The moisture in the mold compound preforms influenced the resultant mechanical properties as well as the warpage of IC packages after molding and post mold curing (PMC) process. The moisture will... View More

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