IEEE - Institute of Electrical and Electronics Engineers, Inc. - Elevated temperature tensile/creep test of UV-LIGA nickel thin film for design of high-density micro connector

IEEE International Solid-State Sensors and Actuators Conference

Author(s): Y. Isono ; J. Tada ; T. Watanabe ; T. Unno ; T. Toriyama ; S. Sugiyama
Sponsor(s): IEEE
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2003
Conference Location: Boston, MA, USA, USA
Conference Date: 8 June 2003
Volume: 1
Page Count: 4
ISBN (Paper): 0-7803-7731-1
DOI: 10.1109/SENSOR.2003.1215352
Regular:

This paper describes mechanical properties of UV-LIGA Ni films at elevated temperatures for design of a high-density micro connector. A compact tensile tester operated under a scanning probe... View More

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