IEEE - Institute of Electrical and Electronics Engineers, Inc. - Micromachined high-aspect-ratio parylene beam and its application to low-frequency seismometer

Proceedings IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems

Author(s): Y. Suzuki ; Yu-Chong Tai
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2003
Conference Location: Kyoto, Japan, Japan
Conference Date: 23 January 2003
Page Count: 4
Page(s): 486 - 489
ISBN (Paper): 0-7803-7744-3
ISSN (Paper): 1084-6999
DOI: 10.1109/MEMSYS.2003.1189792
Regular:

A new microfabrication technology for high-aspect-ratio Parylene structure is developed for soft spring applications and applied to in-plane seismometer which covers low frequency (<1 Hz) and... View More

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