IEEE - Institute of Electrical and Electronics Engineers, Inc. - The introduction of MEMS packaging technology

Proceedings of the 4th International Symposium on Electronic Materials and Packaging

Author(s): C.T. Hsieh ; Jyh-Ming Ting ; C. Yang ; C.K. Chung
Sponsor(s): Nat. Sci. Council
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2002
Conference Location: Kaohsiung, Taiwan, Taiwan
Conference Date: 4 December 2002
Page Count: 7
Page(s): 300 - 306
ISBN (Paper): 0-7803-7682-X
DOI: 10.1109/EMAP.2002.1188855
Regular:

In modem consumer electronic devices, not only the weightless and small-sized but also the multi-function specifications are required. The devices made by MEMS technology have become the major... View More

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