IEEE - Institute of Electrical and Electronics Engineers, Inc. - A promising lead-free material for flip-chip bumps: Sn-Cu-RE

Proceedings of ASDAM'02 (4th International Conference on Advanced Semiconductor Devices and Microsystems)

Author(s): C.M.L. Wu
Sponsor(s): Minist. Educ. Slovak Republic
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2002
Conference Location: Smolenice Castle, Slovakia, Slovakia
Conference Date: 16 October 2002
Page Count: 10
Page(s): 17 - 26
ISBN (Paper): 0-7803-7276-X
DOI: 10.1109/ASDAM.2002.1088465
Regular:

In advanced electronic packaging, flip-chip (FC) bumps are required to be reliable and inexpensive. The Sn-0.7%Cu alloy has been considered as a lead-free material for FC bumps. Various small... View More

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