IEEE - Institute of Electrical and Electronics Engineers, Inc. - Protein folding using inter-residue contact

Proceedings First International Symposium on 3D Data Processing Visualization and Transmission

Author(s): M. Vendruscolo
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2002
Conference Location: Padova, Italy, Italy
Conference Date: 19 June 2002
Page Count: 5
Page(s): 724 - 728
ISBN (Paper): 0-7695-1521-4
DOI: 10.1109/TDPVT.2002.1024149
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