IEEE - Institute of Electrical and Electronics Engineers, Inc. - Cross-sectional elastic imaging and defect detection in low-k spin-on dielectrics

Proceedings of the IEEE 2002 International Interconnect Technology Conference

Author(s): L. Muthuswami ; E.S. Moyer ; Z. Li ; R.E. Geer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2002
Conference Location: Burlingame, CA, USA, USA
Conference Date: 5 June 2002
Page Count: 3
Page(s): 239 - 241
ISBN (Paper): 0-7803-7216-6
DOI: 10.1109/IITC.2002.1014945
Regular:

A novel cross-sectional characterization technique for depth-dependent nanomechanical profiling of low-k dielectrics has been developed based on ultrasonic force microscopy. So-called CS-UFM has... View More

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