IEEE - Institute of Electrical and Electronics Engineers, Inc. - Nondestructive stiffness and density characterization of porous low-k films by surface acoustic wave spectroscopy

Proceedings of the IEEE 2002 International Interconnect Technology Conference

Author(s): C.M. Flannery ; M.R. Baklanov
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2002
Conference Location: Burlingame, CA, USA, USA
Conference Date: 5 June 2002
Page Count: 3
Page(s): 233 - 235
ISBN (Paper): 0-7803-7216-6
DOI: 10.1109/IITC.2002.1014943
Regular:

Nanoporous methylsilsesquioxane (MSSQ) films are a leading candidate for low dielectric constant (k) materials for microelectronic interconnects. Mechanical strength reduces rapidly with... View More

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