IEEE - Institute of Electrical and Electronics Engineers, Inc. - Formation of mechanically strong low-k film using supercritical fluid dry technology
Proceedings of the IEEE 2002 International Interconnect Technology Conference
| Author(s): | S. Ogawa ; T. Nasuno ; M. Egami ; A. Nakashima |
| Publisher: | IEEE - Institute of Electrical and Electronics Engineers, Inc. |
| Publication Date: | 1 January 2002 |
| Conference Location: | Burlingame, CA, USA, USA |
| Conference Date: | 5 June 2002 |
| Page Count: | 3 |
| Page(s): | 220 - 222 |
| ISBN (Paper): | 0-7803-7216-6 |
| DOI: | 10.1109/IITC.2002.1014939 |
Regular:
Supercritical fluid (SCF) dry technology has been applied in formation of a porous low-k film for the first time. The SFC treatment was used to extract templates chemically from the low-k film,... View More
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