IEEE - Institute of Electrical and Electronics Engineers, Inc. - Formation of mechanically strong low-k film using supercritical fluid dry technology

Proceedings of the IEEE 2002 International Interconnect Technology Conference

Author(s): S. Ogawa ; T. Nasuno ; M. Egami ; A. Nakashima
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2002
Conference Location: Burlingame, CA, USA, USA
Conference Date: 5 June 2002
Page Count: 3
Page(s): 220 - 222
ISBN (Paper): 0-7803-7216-6
DOI: 10.1109/IITC.2002.1014939
Regular:

Supercritical fluid (SCF) dry technology has been applied in formation of a porous low-k film for the first time. The SFC treatment was used to extract templates chemically from the low-k film,... View More

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