IEEE - Institute of Electrical and Electronics Engineers, Inc. - Interconnect mechanical reliability with low /spl kappa/ dielectric as final ILD

Proceedings of the IEEE 2002 International Interconnect Technology Conference

Author(s): C. Goldberg ; L. Mercado ; S. Filipiak ; S. Crown
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2002
Conference Location: Burlingame, CA, USA, USA
Conference Date: 5 June 2002
Page Count: 3
Page(s): 209 - 211
ISBN (Paper): 0-7803-7216-6
DOI: 10.1109/IITC.2002.1014936
Regular:

The use of low /spl kappa/ materials as the final intralayer dielectric (ILD) layer can impact the integrity of edge seals, blown fuses, and even the interface integrity at lower levels.... View More

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