IEEE - Institute of Electrical and Electronics Engineers, Inc. - Direct electroless plating of Cu on barrier metals

Proceedings of the IEEE 2002 International Interconnect Technology Conference

Author(s): S. Shingubara ; Z. Wang ; T. Ida ; H. Sakaue ; I. Takahagi
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2002
Conference Location: Burlingame, CA, USA, USA
Conference Date: 5 June 2002
Page Count: 3
Page(s): 176 - 178
ISBN (Paper): 0-7803-7216-6
DOI: 10.1109/IITC.2002.1014925
Regular:

We succeeded in electroless deposition of Cu directly on barrier metals such as TaN, WN, and TiN, without any sputtered Cu layer or Pd catalysis adsorption pretreatment. Electroless deposition was... View More

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