IEC - International Electrotechnical Commission - IEC TR 61760-5-1:2024
Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 31 January 2024 |
| Status: | published |
| Page Count: | 24 |
| ICS Code (Electronic component assemblies): | 31.190 |
abstract:
IEC TR 61760-5-1:2024 describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type... View More
Document History
IEC TR 61760-5-1:2024
January 31, 2024
Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components
IEC TR 61760-5-1:2024 describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic...