IEC - International Electrotechnical Commission - IEC TR 60286-7:2019
Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 14 October 2019 |
| Status: | published |
| Page Count: | 24 |
| ICS Code (Electronic components in general): | 31.020 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
abstract:
IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and... View More
Document History
IEC TR 60286-7:2019
October 14, 2019
Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components
IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and...