IEC - International Electrotechnical Commission - IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 3 September 2021 |
| Status: | published |
| Page Count: | 17 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).
Document History
IEC 61189-2-807:2021
September 3, 2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).