IEC - International Electrotechnical Commission - IEC 61188-6-2:2021
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 4 February 2021 |
| Status: | published |
| Page Count: | 49 |
| ICS Code (Printed circuits and boards): | 31.180 |
| ICS Code (Electronic component assemblies): | 31.190 |
abstract:
IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These... View More
Document History
IEC 61188-6-2:2021
February 4, 2021
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These...