IEC - International Electrotechnical Commission - IEC 61189-2-501:2022
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 3 February 2022 |
| Status: | published |
| Page Count: | 32 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
IEC 61189-2-501:2022 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under... View More
Document History
IEC 61189-2-501:2022
February 3, 2022
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
IEC 61189-2-501:2022 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under...