IEC - International Electrotechnical Commission - IEC 61189-2-801:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 26 July 2023 |
| Status: | published |
| Page Count: | 21 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
IEC 61189-2-801:2023 defines a test method to be followed for thermal performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal... View More
Document History
IEC 61189-2-801:2023
July 26, 2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
IEC 61189-2-801:2023 defines a test method to be followed for thermal performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal...