IEC - International Electrotechnical Commission - IEC 61189-2-803:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 26 July 2023 |
| Status: | published |
| Page Count: | 16 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
IEC 61189-2-803:2023 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA).
Document History
IEC 61189-2-803:2023
July 26, 2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
IEC 61189-2-803:2023 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA).