IEC - International Electrotechnical Commission - IEC 61189-5-501:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes
published
Buy Now
| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 26 January 2021 |
| Status: | published |
| Page Count: | 37 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
IEC 61189-5-501:2021 is used to quantify the deleterious effects of flux residues on surface insulation resistance (SIR) in the presence of moisture.
Document History
IEC 61189-5-501:2021
January 26, 2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes
IEC 61189-5-501:2021 is used to quantify the deleterious effects of flux residues on surface insulation resistance (SIR) in the presence of moisture.