IEC - International Electrotechnical Commission - IEC 61249-2-51:2023
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 11 May 2023 |
| Status: | published |
| Page Count: | 33 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad... View More
Document History
IEC 61249-2-51:2023
May 11, 2023
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad...