IEC - International Electrotechnical Commission - IEC TR 63378-1:2021
Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 14 December 2021 |
| Status: | published |
| Page Count: | 20 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
IEC TR 63378-1:2021(E) specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal... View More
Document History
IEC TR 63378-1:2021
December 14, 2021
Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
IEC TR 63378-1:2021(E) specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal...