IEC - International Electrotechnical Commission - IEC TR 62878-2-9:2022
Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
published
Buy Now
| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 27 April 2022 |
| Status: | published |
| Page Count: | 15 |
| ICS Code (Printed circuits and boards): | 31.180 |
| ICS Code (Electronic component assemblies): | 31.190 |
abstract:
IEC TR 62878-2-9:2022(E) comprises the long-term discussion among Jisso International Council (JIC) members during 1999 and 2005, when the interim agreement among all JIC members about the... View More
Document History
IEC TR 62878-2-9:2022
April 27, 2022
Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
IEC TR 62878-2-9:2022(E) comprises the long-term discussion among Jisso International Council (JIC) members during 1999 and 2005, when the interim agreement among all JIC members about the “concept...