IEC - International Electrotechnical Commission - IEC 62878-2-602:2021
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 22 June 2021 |
| Status: | published |
| Page Count: | 24 |
| ICS Code (Printed circuits and boards): | 31.180 |
| ICS Code (Electronic component assemblies): | 31.190 |
abstract:
IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.
Document History
IEC 62878-2-602:2021
June 22, 2021
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.