IEC - International Electrotechnical Commission - IEC 61189-2-804:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 25 August 2023 |
| Status: | published |
| Page Count: | 16 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this... View More
Document History
IEC 61189-2-804:2023
August 25, 2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation...