IEC - International Electrotechnical Commission - IEC 61189-5-601:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 3 February 2021 |
| Status: | published |
| Page Count: | 80 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
IEC 61189-5-601:2021 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed... View More
Document History
IEC 61189-5-601:2021
February 3, 2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
IEC 61189-5-601:2021 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed...