IEC - International Electrotechnical Commission - IEC TR 61760-3-1:2022
Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 17 June 2022 |
| Status: | published |
| Page Count: | 26 |
| ICS Code (Electronic component assemblies): | 31.190 |
abstract:
IEC TR 61760-3-1:2022(E) supplements IEC 61760-3 to describe examples of solder paste supply methods, the relationship between the terminal position tolerance and the through hole diameter, and... View More
Document History
IEC TR 61760-3-1:2022
June 17, 2022
Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
IEC TR 61760-3-1:2022(E) supplements IEC 61760-3 to describe examples of solder paste supply methods, the relationship between the terminal position tolerance and the through hole diameter, and...