IEC - International Electrotechnical Commission - IEC 62047-35:2019

Semiconductor devices - Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices

published
Buy Now
Organization: IEC - International Electrotechnical Commission
Publication Date: 22 November 2019
Status: published
Page Count: 41
ICS Code (Other semiconductor devices): 31.080.99
abstract:

IEC 62047-35:2019 specifies the test method of electrical characteristics under bending deformation for flexible electromechanical devices. These devices include passive micro components and/or... View More

Document History

IEC 62047-35:2019
November 22, 2019
Semiconductor devices - Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices
IEC 62047-35:2019 specifies the test method of electrical characteristics under bending deformation for flexible electromechanical devices. These devices include passive micro components and/or...
Advertisement