IEEE - Institute of Electrical and Electronics Engineers, Inc. - Automated I/O Library Generation for Interposer-Based System-in-Package Integration of Multiple Heterogeneous Dies

Author(s): Minah Lee ; Arvind Singh ; Hakki Mert Torun ; Jinwoo Kim ; Sung Kyu Lim ; Madhavan Swaminathan ; Saibal Mukhopadhyay
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2020
Volume: 10
Page(s): 111 - 122
ISSN (Electronic): 2156-3985
ISSN (Paper): 2156-3950
DOI: 10.1109/TCPMT.2019.2953659
Regular:

System-in-package (SiP) integration of multiple dies in a single package can achieve much higher performance than onboard integration of integrated circuits (ICs) while reducing the design... View More

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