IEEE - Institute of Electrical and Electronics Engineers, Inc. - Co-Fabrication of Microcoaxial Interconnects and Substrate Junctions for Multichip Microelectronic Systems

Author(s): Daniela A. Torres ; Anthony Kopa ; Robert D. White ; Caprice Gray
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2020
Volume: 10
Page(s): 151 - 159
ISSN (Electronic): 2156-3985
ISSN (Paper): 2156-3950
DOI: 10.1109/TCPMT.2019.2955553
Regular:

RF and millimeter-wave designers continue to use wire bonds and flip chip in their designs when bonding chips or multichip systems. Due to electrical and mechanical constraints of wire bonding and... View More

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