IEEE - Institute of Electrical and Electronics Engineers, Inc. - Solid–Liquid Interdiffusion Bonding of Cu–Sn–Cu Interconnection and Sealing for High-Temperature Pressure Sensor Based on Graphene

Author(s): Junqiang Wang ; Shiliang Zhao ; Mengwei Li ; Pengcheng Wang ; Minghao Li
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2020
Volume: 10
Page(s): 65 - 71
ISSN (Electronic): 2156-3985
ISSN (Paper): 2156-3950
DOI: 10.1109/TCPMT.2019.2951720
Regular:

Cu-Sn-Cu solid-liquid interdiffusion (SLID) bonding for high-temperature pressure sensors based on graphene has been investigated. Square bumps with a length of 160 μm and an 80-μm-wide... View More

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