IEEE - Institute of Electrical and Electronics Engineers, Inc. - A Study on the Fabric Substrates With Fine-Pitch Laminated Cu Metal Patterns Using B-Stage Adhesive Films

Author(s): Seung-Yoon Jung ; Seung Jin Oh ; Tae-Ik Lee ; Taek-Soo Kim ; Kyung-Wook Paik
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2020
Volume: 10
Page(s): 176 - 183
ISSN (Electronic): 2156-3985
ISSN (Paper): 2156-3950
DOI: 10.1109/TCPMT.2019.2936514
Regular:

Cu pattern-laminated fabric substrates using epoxybased B-stage adhesive films were demonstrated. Fine-pitch Cu electrical patterns were fabricated on B-stage adhesive films and then laminated to... View More

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